tin lead solder paste, solder cream stability,strong continuous printing; good viscosity;without slumping, bridging or splashing Sn63/Pb37 tin lead solder paste, solder creamchracteristics:1. Excellent stability,resolving power for continuous printing; good viscosity2. Without...

lead free solder paste Sn-0.3Ag-0.7Cu, solder cream 1. Excellent stability,resolving power for continuous printing  lead free solder paste  tin lead solder paste, solder creamchracteristics:1. Excellent stability,resolving power for continuous printing; good viscosity2....

1>tin lead solder paste, no clean, stable, 2>good viscosity 3>without causing slumping, bridging or splashing Sn63/Pb37 solder paste:chracteristics:1. Excellent stability,resolving power for continuous printing; good viscosity2. Without causing slumping, bridging or...

Environmentally friendly; Non-hydrophilic, good solderability even under high temperature and humidity      Sn-0.3Ag-0.7Cu lead free solder paste:Model NO. ZXRM302PMelting point: 217-227oCCharacteristics:    Printing characteristic:...

Sn63/Pb37 tin lead solder paste, solder cream 1. Excellent stability,resolving power for continuous printing; good viscosity Sn63/Pb37 tin lead solder paste, solder creamchracteristics:1. Excellent stability,resolving power for continuous printing; good viscosity2. Without...

solder paste, lead free solder paste, green paste, Non-hydrophilic, good solderability even under high temperature and humidity      Sn-3.0Ag-0.5Cu-Ce lead free solder paste:Model NO. ZXRM401PMelting point: 216-221oCSpec gravity: 4.5-5.0Flash Point:...